基于SOI材料的兵器微电子技术应用分析  

Application research of micro - electron technology for ordnance equipment based on SOI material

作　　者：张新[1] 高勇[1] 王彩琳[1] 邢昆山 安涛[1] 

机构地区：[1]西安理工大学自动化学院,陕西西安710048 [2]华东光电集成器件研究所,安徽蚌埠233042

出　　处：《兵器材料科学与工程》2005年第3期48-53,共6页Ordnance Material Science and Engineering

摘　　要：随着集成技术进入亚微米阶段,传统的硅基集成电路由于存在闩锁等不利因素,使其应用受到了限制。而基于SOI材料的微电子技术是能突破硅材料与硅集成电路限制的新技术,是国际半导体的前沿技术之一,是发展兵器装备用元器件的又一关键材料技术。介绍了SOI材料结构技术用于微电子器件的优势、SOI结构及基于SOI结构材料的兵器微电子技术应用,展望了SOI技术的发展前景。In this paper, SOI technology for ordnance equipment is reported. With the silicon IC technology into sub - micro, the application of silicon IC in many areas is restricted, because of its unfavorable factors such as latch effect, etc. The micro - electronic technology based on SOI material is a new technology which breaks out the restrictions of silicon material and silicon IC, and a key technology used in ordnance equipment. In this paper, the superiorities of semiconductor device based on SOI, SOI structure, and micro - electron technology based on SOI material are introduced, and prospects for SOI technology are forecasted.

关 键 词：SOI材料 SOI结构 兵器微电子 半导体集成电路 

分 类 号：O47[理学—半导体物理] TN4[理学—物理]