硅KOH腐蚀<100>晶向凸角补偿技术及应用  

Compensation technique for <100> convex corner undercutting in KOH anisotropic etching of silicon and its application

作　　者：王浙辉[1] 李昕欣[1] 王跃林[1] 

机构地区：[1]中国科学院上海微系统与信息技术研究所传感技术国家重点实验室,上海200050

出　　处：《传感器技术》2005年第7期22-24,共3页Journal of Transducer Technology

基　　金：国家重点基础研究发展规划资助项目(G1999033104)

摘　　要：在(100)硅上制作边沿<100>晶向的长方形掩模,用KOH各向异性腐蚀液腐蚀可制得竖直微镜,这种微镜存在凸角削角问题。研究了边沿<100>晶向掩模的凸角补偿技术,提出了2种凸角补偿图形,并应用于竖直微镜制作。实验表明“工”形补偿可获得方正的反射面;“Y”形补偿的微镜,反射面呈底角为75.96°的梯形。经补偿后的微镜,可提高光开关切换光束效率。讨论了(100)硅的<100>晶向掩模凸角补偿技术应用于微机械加速度计质量块制作的可能性。The vertical micromirror can be fabricated with the mask which sides aligned the <100> direction on silicom(100)etched by aqueous KOH.It has under cutting near the convex corner.The compensation technique for convex corner undercutting using <100> mask is studied and two kinds of additional mask patterns are presented.This technique has been used in fabricating vertical mirrors.The “工” shape mask can get rectangle reflective face.The “Y” shape mask can get trapezoid reflective face with the angle of 75.96°.The efficiency to switch laser beam can be improved for optical switch.This compensation technology of the <100> direction on silicon (100) may be applied on fabricating the mass block for micro-mechanical accelerometer.

关 键 词：各向异性腐蚀 削角补偿 微镜 微机械加工 

分 类 号：TN305[电子电信—物理电子学]