PZT厚膜拾振器微图形化工艺研究  

Study on Micro-patterning of Vibration Pickup Device Based on PZT Thick Films

作　　者：方华斌[1] 刘景全[1] 徐峥谊 王莉 陈迪[1] 蔡炳初[1] 刘悦 

机构地区：[1]上海交通大学微纳科学技术研究院薄膜与微细技术教育部重点实验室微米/纳米加工技术国家级重点实验室,上海200030 [2]美国Honeywell公司上海传感器实验室,上海200030

出　　处：《微细加工技术》2005年第4期48-51,共4页Microfabrication Technology

摘　　要：采用sol-gel方法制备了PZT铁电厚膜,构成了SiO2/Si/SiO2/Ti/Pt/PZT/Ti/Pt形式的拾振器敏感元结构。基于半导体光刻技术,通过干法刻蚀电极和化学湿法刻蚀PZT厚膜等技术,成功地实现了敏感元的微图形化,解决了Pt/Ti下电极刻蚀难、制作的PZT膜形貌不好和上电极容易起壳等问题,为基于PZT厚膜的高性能拾振器的研制打下了良好的基础。PZT thick films are prepared through sol-gel method and sensor cell structure of Si/ SiO2/Ti/Pt/PZT/Ti/Pt is formed. Based on optical lithography, the dry etching techniques for electrode and wet chemical etching techniques for PZT thick film were studied to realize the micro patterning of the sensor ceil. Challenges such as etching Pt/Ti bottom electrode, morphology of PZT film and peeling of top electrode are solved, which laid solid foundations for the research and development of the high performance vibration pickup device.

关 键 词：拾振器 PZT厚膜 PT/TI电极 湿法化学刻蚀 干法刻蚀 

分 类 号：TN305[电子电信—物理电子学]