堆叠封装的最新动态  

Recent Developments in Stacked Package

作　　者：翁寿松[1] 

机构地区：[1]无锡市罗特电子有限公司,江苏无锡214001

出　　处：《电子与封装》2006年第5期1-4,共4页Electronics & Packaging

摘　　要：文章介绍了堆叠封装的最新动态,包括芯片堆叠封装、封装堆叠封装、系统级封装、多芯片封装、堆叠芯片尺寸封装和三维封装等。文章归纳出当前堆叠封装的发展方向是:种类越来越多、市场越来越大、高度越来越薄、功能越来越多和应用越来越广等。In This paper, recent developments in stacked package are introduced, it include stacked chips package package on package stacking, system in a package multi chip package, stackage chips size package and 3D package etc.The developmental trends in stacked package are discussed e,g. the kind is becoming more and more the market is becoming bigger and bigger, the height is becoming thinner and thinner the function is becoming more and more and the application is becoming wider and wider etc.

关 键 词：堆叠封装 芯片堆叠封装 封装堆叠封装 系统级封装 多芯片封装 

分 类 号：TN305.94[电子电信—物理电子学]