MEMS器件的封装材料与封装工艺  

Package Materials and Processes of MEMS Devices

作　　者：严雪萍[1] 成立[1] 韩庆福[1] 张慧[1] 李俊[1] 刘德林[1] 徐志春[1] 

机构地区：[1]江苏大学电气与信息工程学院,江苏镇江212013

出　　处：《半导体技术》2006年第12期900-903,919,共5页Semiconductor Technology

基　　金：江苏省高校自然科学研究基金项目(04KJB310171)

摘　　要：随着各种MEMS新产品的不断问世,先进的MEMS器件的封装技术正在研发之中。本研究综述了MEMS的封装材料,包括陶瓷、塑料、金属材料和金属基复合材料等。阐述了MEMS的主要封装工艺和技术,包括圆片级封装、单芯片封装、多芯片组件和3D堆叠式封装等。并展望了MEMS器件封装的应用和发展前景。With continuous invention of various new products of MEMS, advanced package technologies of MEMS are being researched and developed. Account of package materials of MEMS, including ceramics, plastic, metal material and metal compound material, etc was given. Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3D packaging, etc were discussed. The applications and future developments of MEMS package were prospected.

关 键 词：微电子机械系统 封装技术 封装材料 技术优势 

分 类 号：TN305.94[电子电信—物理电子学]