MEMS器件真空封装内部真空度测试的研究  

Research of Vacuum Measurement of Vacuum Packaged MEMS Devices

作　　者：汪学方[1] 甘志银[1] 刘胜[1] 张鸿海[1] 林栋[1] 王成刚[1] 

机构地区：[1]华中科技大学,湖北武汉430074

出　　处：《仪表技术与传感器》2007年第4期76-78,共3页Instrument Technique and Sensor

摘　　要：为了解决MEMS器件真空封装内部真空度测试难题,提出采用晶振作为传感器来对内部真空度进行测量,设计并研制了一套基于晶振传感的真空度测量系统。通过实验得到:不同晶振的标定曲线不同;晶振在不同温度下所测得的标定曲线也不同;采用晶振的老化实验来筛选晶振;晶振的回标实验证明采用晶振作为传感器来对内部真空度进行测量的方法是可行的。In order to solve the problem of raeasuring the vacuum degree in vacuum packaged MEMS devices,crystal oscillator has been used as the sensor to measure the vacuum degree. A vacuum measurement system.has been designed and developed. The experiment results show that different oscillators have different calculation curves, and the same oscillator at different temperature have different caculation curves. Aging experiment should be carried out before practical using. The calculation experiment after the vacuum packaging shows the method is feasible.

关 键 词：晶振 真空度 真空封装 MEMS 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]