激光键合技术在封装中的应用及研究进展  

Application and Research Progress of Laser Bonding Technology in Packaging

作　　者：田艳红[1] 王春青[1] 孔令超[1] 

机构地区：[1]哈尔滨工业大学现代焊接生产技术国家重点实验室微连接研究室,黑龙江哈尔滨150001

出　　处：《电子工业专用设备》2007年第5期22-28,共7页Equipment for Electronic Products Manufacturing

基　　金：国家自然科学基金资助项目(E50475031)

摘　　要：激光键合技术以其局部非接触加热、灵活性强和可控性能好的优点在电子封装、光电子封装以及MEMS封装中得到了应用。以几种激光键合技术的研究和应用为实例,分析和探讨了激光键合技术中的关键问题及其发展趋势。Laser bonding technelogy, which offters the advantages of non-contact, local heating and flexibility, has attracted more attention in electronic, optoelectronic and MEMS packaging. In this paper, several case studies on laser bonding technologies were presented, and major problems in research and applications as well as the trend of laser bonding technology were analysed and discussed.

关 键 词：激光键合技术 电子封装 光电子封装 MEMS封装 

分 类 号：TG456.7[金属学及工艺—焊接]