UV-LIGA制作微细群电极工艺研究  

Process Study of Micro Electrode Arrays

作　　者：胡洋洋[1] 朱荻[1] 曾永彬[1] 明平美[2] 

机构地区：[1]南京航空航天大学,南京210016 [2]河南理工大学,焦作454000

出　　处：《电加工与模具》2008年第1期29-31,35,共4页Electromachining & Mould

摘　　要：微细电火花加工和微细电解加工是当前微细加工领域的研究热点,利用微细群电极进行微细加工可显著提高加工效率。研究了UV-LIGA制作微工具电极的技术。以金属为基底,采用UV-LIGA工艺来制作微细群电极,改进了前烘、后烘、显影等工艺参数,分别在铜和不锈钢基底上通过注射式倒胶的方法制作出厚度达1 mm的SU-8胶结构,最大深宽比达10∶1,并通过微细电铸,获得了铜微细电极。Micro-EDM and micro-ECM are the research hotspots in the micro-fabrication field. Use the electrode arrays can enhance the efficiency of the micro-EDM and the micro-ECM. In order to fabricate the multiple electrodes, it＇s necessary to use the metal substrate to fabricate the ultra-thick SU-8 microstructures in the UV-LIGA process. This paper optimized the characteristics of the UV- LIGA process such as coating method, pre-bake temperature ＆ time, exposure time, post-bake temperature ＆ time, and the development time. 1 mm thick and 10 ： 1 aspect ratio SU-8 micro-structures were fabricated through the constant volume-injection casting on the substrates of copper and stainless steel. The micro electrode arrays was obtained through electroforming process.

关 键 词：金属基底 UV—LIGA工艺 SU-8胶 高深宽比 微细群电极 

分 类 号：TN305.7[电子电信—物理电子学]