采用热压焊工艺实现金凸点芯片的倒装焊接  

Assembly of Flip Chip Gold Bumps With Thermo-compression Bonding Process

作　　者：张彩云[1] 霍灼琴[1] 高敏[1] 张晨曦[1] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工艺技术》2008年第1期28-29,32,共3页Electronics Process Technology

摘　　要：金凸点芯片的倒装焊接是一种先进的封装技术。叙述了钉头金凸点硅芯片在高密度薄膜陶瓷基板上的热压倒装焊接工艺方法,通过设定焊接参数达到所期望的最大剪切力,分析研究互连焊点的电性能和焊接缺陷,实现了热压倒装焊工艺的优化。同时,还简要介绍了芯片钉头金凸点的制作工艺。Assembly of flip chip gold bumps is an advanced electronic packaging technology. Describe the assembly of Si chips bumped Au studs on high density thick film ceramic substrates with thermo - compression bonding. In order to optimize the thermo - compression bonding process, the bonding parameters were optimized with respect to the maximum shear strength,electrical quality of the interconnec- tion and possible defects on chip were investigated. Simultaneity introduce the bumping technology of Au studs of chips.

关 键 词：倒装焊 热压焊 金凸点芯片 薄膜基板 

分 类 号：TN60[电子电信—电路与系统]