基于功率型LED散热技术的研究  

Research of Heat Release Technology of Based on Power-LED

作　　者：刘一兵[1,2] 黄新民[1,2] 刘国华[1,2] 

机构地区：[1]湖南大学信息与电气工程学院,湖南长沙410082 [2]邵阳职业技术学院机电工程系,湖南邵阳422000

出　　处：《照明工程学报》2008年第1期69-73,共5页China Illuminating Engineering Journal

摘　　要：散热制约了LED功率的进一步提高。本文在分析功率LED受热效应影响的基础上,从改进LED结构角度来解决散热问题。芯片采用倒装焊结构,可降低热阻,提高散热能力,对倒装焊结构的热能扩散途径进行了阐述,指出采用导热性能优良的封装材料是提高散热效率的重要途径。并对密封材料,键合材料,散热基板对散热的影响作了详细的分析,最后介绍了采用热沉散热的最新进展,并提出了今后的研究方向。Heat release has resisted more improvment of LED powers. On the foundation of heat effect of power-LED, point out solution method of heat releae by changing LED structure. The chip that used flip-chip structure could reduce heat resistance and improve heat release. Summrized thermal dispersion channel of flip-chip structure. Point out that Using Packaging materials with high thermal conductivity is important for improving heat release efficiency. The heat release impact becase of packaging material, die bonding material ane thermal spreading substracte are analysized. At last, the later progresses that used for sink cooling were introduced and pointed out further research direction.

关 键 词：功率LED 散热 倒装焊 封装材料 

分 类 号：TN312.8[电子电信—物理电子学]