基于CQFP 64线外壳的封装寄生参数研究  

Study on Parasitic Effect of Packaging Based on CQFP 64-Lead Package

作　　者：徐炀[1] 李茂松[1] 陈鹏[1] 黄大志[1] 

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2008年第4期507-509,共3页Microelectronics

摘　　要：封装寄生效应对高频器件性能的影响越来越明显。为了在高频器件设计中充分考虑寄生参数的影响,需对封装的寄生效应进行模拟,以便保持高频电路封装后信号的完整性。利用An-fost公司的软件Q3D和HFSS,对CQFP 64管壳的引脚和键合线进行电磁仿真分析,提取出三维封装结构的RLC参数和高频下的S参数;分析管壳在封装前后、不同频率、不同封装环境下寄生参数的变化情况;将仿真结果与实验结果进行了对比,为设计人员设计产品提供依据。Parasitic effects of packaging have significant effect on performance of RF IC＇s. A 3-D modeling was made on CQFP 64-lead package using Q3D and HFSS of Ansoft to analyze its parasitic parameters. Based on RLC and S parameters extracted from modeling, variation of parasitic parameters of CQFP 64-lead package before and after packaging at different frequencies and under different packaging environments was discussed. And finally, a comparison was made between simulation and experimental results to provide reference for designers.

关 键 词：电子封装 高频器件封装 寄生效应 

分 类 号：TN305.94[电子电信—物理电子学]