Pyrex玻璃／铝多层阳极键合界面结构与力学分析  

The interface microstructure and mechanical property of the multi-layer wafer of pyrex glass and Al by the common anode bonding process

作　　者：鲁晓莹[1] 刘翠荣[1] 孟庆森[1] 杨振宇[2] 赵亚溥[2] 

机构地区：[1]太原理工大学材料与科学工程学院,山西太原030024 [2]中科院力学所非线性力学国家重点实验室,北京100086

出　　处：《功能材料》2008年第9期1466-1469,共4页Journal of Functional Materials

基　　金：国家自然科学基金资助项目(50375015,50671070)

摘　　要：采用公共阳极法实现了Pyrex玻璃与铝多层晶片的静电键合,对玻璃/铝/玻璃阳极接合界面的组织结构及其连接机理和力学特征进行了重点研究。分别利用微拉伸测试设备和ANSYS软件分析了连接区的力学性能和残余应力分布特征。分析认为键合区由玻璃-过渡层-铝组成,过渡层为Al2O3-SiO2复合氧化物。玻璃/铝界面的微观组织和元素分布均以铝为对称轴呈对称分布。在玻璃/铝/玻璃多层连接区,键合界面附近的残余应力和应变呈对称分布,多层结构的对称性有利于缓解接头应变和应力,表明应用公共阳极法可实现多层玻璃/铝/玻璃的良好键合。The bonding of multi-layer of glass and aluminum stack was achieved by the common anode bonding process. The bonding mechanism and mechanical property of the glass/aluminum/glass joints were investigated in the paper. The mechanical property and the residual stress of the glass/aluminum/glass bonded wafers were analyzed by means of the micro-tension test and the software of ANSYS. It is founded that the bonding area is consisted of the glass-transition layer-aluminum, and the transition layer is the combined metal oxide of the Al2O3-SiO2. The mierostrueture and distribution of the elements are symmetrical in both sides of the aluminum interfaces. The residual stress and strain near the bonded interface are symmetrical in the bonding area of the multi-layer glass/aluminum/glass. The symmetry property of the multi-layer structure is beneficial to mechanical property of the joints. It indicates that the multi-layer glass/aluminum/glass wafers can be bonded firm due to the application of a common anode process.

关 键 词：阳极键合 铝 Pyrex玻璃 力学特征 MEMS 

分 类 号：TG453.9[金属学及工艺—焊接]