裸芯片封装技术的发展与挑战  

Development and Challenge of Bare Die Technology

作　　者：吴少芳[1] 孔学东[2] 黄云[2] 

机构地区：[1]广东工业大学,广州510075 [2]电子元器件可靠性物理及其应用技术国家级重点实验室,广州510610

出　　处：《电子与封装》2008年第9期1-3,7,共4页Electronics & Packaging

摘　　要：随着IC制造技术的发展,传统的封装形式已经不能够满足集成电路对于高性能、高集成度、高可靠性的要求。裸芯片由于其本身具有的特点而被广泛应用于HIC/MCM等新型的封装形式中。文章的目的在于分析使用裸芯片所带来的技术优势和存在的一些不足之处,使得人们能够更加客观地看待一种新的技术,并且扬长避短地利用好它。一方面裸芯片的引入能够提高系统集成度和速度,这是裸芯片应用技术发展的必然性;另一方面针对裸芯片应用技术存在的问题,文章着重介绍了两种解决方法,即通过发展KGD技术和改进工艺的方法来提高裸芯片的质量和可靠性。With the development of IC manufacture, the traditional encapsulation technology has not to satisfy the integrate circuits anymore, which are high performance, high integration and high reliability. As a result, bare dies are widely used in the new encapsulation technology currently, such as HIC and MCM, because of their advantages. The advantages and disadvantages of bare die technology are presented in this article, so as to make people can make a most use of bare die technology.One side, the use of bare die can improve the intergration and speed of the system, it＇ s the inevitability of bare die technology. The other side, aim at the problem of bare die technology, to improve the quality and reliability of bare die, the artile introduced two methods, that is develop KGD and ameliorate technics measure.

关 键 词：裸芯片 多芯片组件 已知良好芯片 

分 类 号：TN305.94[电子电信—物理电子学]