铜丝键合工艺研究  

The Technics Research of Copper Wire Bonding

作　　者：常红军[1] 王晓春[1] 费智霞[1] 慕蔚[1] 李习周[1] 冯学贵[1] 鲁明朕[1] 

机构地区：[1]天水华天科技股份有限公司,甘肃天水741000

出　　处：《电子工业专用设备》2009年第5期16-20,共5页Equipment for Electronic Products Manufacturing

摘　　要：讲述了铜丝键合的优点,列举了铜丝在键合工艺中制约制程的瓶颈因素有两个方面:一是铜丝储存条件对环境要求高,使用过程保护措施不当易氧化;二是铜丝材料特性选择、制具选择、设备键合参数设置不当在生产制造中易造成芯片焊盘铝挤出、破裂、弹坑等现象发生,最终导致产品电性能及可靠性问题而失效。本文通过对铜丝键合机理分析,提出解决、预防及管控措施,制定了具体的生产管控工艺方案,对实现铜丝键合工艺有很好的指导意义。In the beginning of this paper, it describes the advantages of copper-wire bonding, then high-lights the two major bottle-necks which limit the copper-wire bonding process： One is the high request for store environment of copper-wire. That means copper-wire should be well protected to prevent the oxidation issue during the processes; the other is that the products electrical function or reliability test would be failed because the bond-pad Al bleed-out,bond-pad broken,bond-pad crating problems if we use the unsuitable characteristic copper-wire, unsuitable jigs or wrong bonding parameters. This paper shows the related bonding intermetallic analysis, and provides the solution,prevention and control method for copper-wire bonding process. It provides a very good guide-line to realize the copper-wire process with the actual production control rule.

关 键 词：铜丝 键合 弹坑 工艺方案 

分 类 号：TN305[电子电信—物理电子学]