两电极多层阳极键合实验研究  

Study on multi-stack anodic bonding using two electrodes

作　　者：张廷凯[1] 甘志银[1] 张鸿海[1] 

机构地区：[1]华中科技大学机械学院微系统研究中心武汉光电国家实验室,湖北武汉430074

出　　处：《传感器与微系统》2009年第7期21-23,共3页Transducer and Microsystem Technologies

基　　金：国家"863"计划资助项目(2006AA04Z346)

摘　　要：介绍了用2个电极通过一次电极反接的方式实现多层样片之间阳极键合的操作工艺和键合机理,并以玻璃—硅—玻璃三层结构为例对其进行了实验研究。结果显示:多余的玻璃对第一次键合过程的电流特性影响不大,而第一次键合的玻璃对第二次键合电流产生显著的影响,电流出现不规则的突变。而且,在第二次键合过程中,第一次键合的玻璃在键合面上会出现由于钠元素积聚而产生的黄褐色斑点。拉伸强度实验的结果表明:第二次键合过程中在第一次键合面形成的反向电压会减弱键合的强度;通过合理选择键合参数可以得到满足MEMS封装要求的键合强度。Multi-stack anodic bonding using two electrodes is realized. Experimental study is performed based on glass-silicon-glass triple-stack structure. As one of the results the additional glass rarely influences on the first bonding but the first bonded glass influences on the second bonding as there are irregularly current breaks. Sodium clustering induced yellow-brown points appears on the second anodic bonding. Strength testing results show that reversal potential during the second bonding between the first bonding interface makes the strength on the first bonded interface worse, but this bonding method is still fit for MEMS package under optical parameters.

关 键 词：阳极键合 微机电系统 多层键合 封装 

分 类 号：TN305[电子电信—物理电子学]