集成电路封装溢料问题探讨  

Concerning on Mold Flash Issues of IC Plastic Packaging

作　　者：慕蔚[1] 周朝峰[1] 孟红卫[1] 李习周[1] 冯学贵[1] 鲁明朕[1] 

机构地区：[1]天水华天科技股份有限公司,天水741000

出　　处：《电子与封装》2009年第7期13-16,21,共5页Electronics & Packaging

摘　　要：溢料问题是集成电路封装过程中常见的质量问题,如何减少溢料的发生和去除溢料方法是封装工程师、电镀工程师以及材料生产商和模具制造商共同探讨的课题。文章详细阐述了集成电路封装过程中常见的溢料发生机理,描述了溢料对组装的危害、如何防止溢料的发生以及溢料去除方法,并且对溢料去除方法的未来发展进行了展望。文中对溢料的发生机理方面进行了细致的研究,从材料、设备以及工艺方法等方面进行深入的解析,提出了有效的改善措施。另外,对业内溢料去除的几种方法进行介绍的同时,强调了各种溢料去除方法的效果及对产品质量的影响,并进行了有效评估。文章对溢料发生和去除方法的探讨是建立在理论基础之上,运用最细致的解析手段进行剖析,更具有指导意义,为提高集成电路封装良率以及组装良率提供理论支持。Mold-flash is a kind of quality issue which is usually found during the IC plastic molding process. How to avoid the mold-flash and how to deflash are the common research subject for all the assembly molding engineers, plating engineers, materials suppliers and also tooling manufacturers. This paper elaborates on the common causes of mold-flash, discusses the harmfulness of the mold-flash, point out how to avoid the moldflash and the methods of deflashing, and also looks forward to the future development of such methods. Through a thorough study of the mechanism of mold-flash generation, and it makes a detail analysis about materials, equipments and process etc. to put forward some effective improvement measures. In addition, the paper emphasizes on the effectiveness of all kinds of deflashing methods and their influence on product quality by verified an effective assessment. The paper differs from others in that it not only has a magnificent foundation in theory, but the most detailed analytic methods are used in the paper to conduct analysis, in this case the discussion in this paper is more instructive, and lays a theoretical foundation for improving the IC molding yield and assembly yield.

关 键 词：集成电路封装 溢料 改善 预防 去除方法 

分 类 号：TN305.94[电子电信—物理电子学]