硅片的直接键合  

Direct Bonding of Silicon Wafers

作　　者：王敬[1] 屠海令[1] 刘安生[1] 张椿[1] 周旗钢[1] 朱悟新[1] 

机构地区：[1]北京有色金属研究总院

出　　处：《稀有金属》1998年第5期380-384,共5页Chinese Journal of Rare Metals

摘　　要：介绍了硅片的直接键合工艺、键合机理。Wafer Bonding has emerged as a material combination technique with wide application. In this paper, the direct bonding process of silicon wafers, bonding mechanisms, characterizing method of bonding quality, and the present research and application status of wafer bonding were introduced briefly.

关 键 词：硅片 硅片键合 直接键合 材料复合 

分 类 号：TB332[一般工业技术—材料科学与工程]