塑封器件无损开封技术介绍  

Introduction of Non-destructive Decapsulate Technology for Plastic Encapsulated Microchips

作　　者：尹颖 朱卫良[1] 

机构地区：[1]中国电子科技集团公司第58研究所,江苏无锡214035

出　　处：《电子与封装》2009年第9期12-15,19,共5页Electronics & Packaging

摘　　要：随着现代微电子行业的发展,对产品质量和结构安全性、使用可靠性提出了越来越高的要求。由于无损检测(NTD)技术具有不破坏试件、检测灵敏度高等优点,其应用日益广泛。塑封材料又以其低成本、生产工艺简单、适合大规模生产等特点,占据了整个微电子封装材料97%以上的市场。文章对塑封器件的开封技术及需要注意的事项进行了较详细的介绍和说明,列出了针对各种封装形式的无损开封方案,为无损开封的实际应用提供了便利。通过对塑封器件开封办法的研究,确保塑封器件的开封质量,为进一步对塑封器件进行DPA和失效分析建立了基础。Along with the development of modem micro-electronics industry, more and more attention is put on the product higher quality and reliability. As the detecting technology is nondestructive, it has come into increasingly wide use with its perfect precision. Besides, as a result of its low-cost and simple procedure, Non- destructive decapsulate technology has occupied more than 97% of the entire micro-electronic unpackaging market. This paper concerns on the introduction of decapsulate methods for plastic encapsulated microchips. It illuminnates decapsulate ways of deferrient types package, which makes convenience to practical application of non-destructive decapsulation. Research on the decapsulate technology guarantees the quality of decapsula- tion. Furthermore, it also provides basis for further DPA and failure analysis.

关 键 词：塑封器件 封装形式 无损 开封 

分 类 号：TN402[电子电信—微电子学与固体电子学]