Au丝键合改为Cu丝键合技术  

Bonding Technology of Brass Wires in Stead of Spun Gold

作　　者：赵义坤 王华 耿凯鸽 唐娟 

机构地区：[1]西安高科卫光电子有限公司,西安710065

出　　处：《半导体技术》2010年第3期237-240,共4页Semiconductor Technology

摘　　要：现阶段Au丝作为内引线一直占着键合的主导地位,由于Cu丝具有优良的电性能和价格优势,随着键合技术的发展,以Cu丝代替Au丝作为键合用内引线已经成为必然,封装行业许多厂家正热衷于将原有的Au丝键合设备进行改造,但还存在这样那样的问题。以Au丝键合改为Cu丝键合的技术研究为出发点,首先介绍了键合技术的发展,然后通过工艺调整和设备改造,使得Cu丝作为内引线能够代替Au丝在该设备上使用,同时达到了节约生产成本,节约资金的目的。对改造过程中的气体流量、压力、功率、焊接时间等参数问题进行了详细地阐述,同时对芯片、键合劈刀等也做了相应调整,使得改造后的检测结果完全满足产品要求。大力推进以Cu丝替代Au丝键合技术,可节约生产成本,提高键合强度,增强导电率、导热率等,具有重要的经济技术效益,必将迎来封装业的又一次大变革。At present, though the spun gold as the inner down-lead is in the highest flight, with the development of bonding technology, the use of brass wires instead of the spun gold as the inner down-lead is the direction, because the brass wires has good electric conductivity and low price. In packaging industry, many manufacturers are keen on the renovation of the original equipment to reduce the production cost, although the new bonding technology has lots of problems. This text based on the technology research of using brass wire bonding instead of the spun gold bonding, it introduced the development of bonding technology first, and then adjusted the technics and renovated the equipment, so as to realize the brass wires instead of the spun gold as the inner down-lead on the equipment to save production costs. It is taking the gas flow; pressure, power, welding time and other parameters in the process of renovation into account, and adjusting the chip, chopper and other things to make the renovated test result fully satisfy the product requirements. So, greatly promoting the brass wires instead of the spun gold bonding will bring us many benefits, such as, saving production costs, improving bonding strength, enhancing the electrical conductivity and thermal conductivity. These economic and technological benefits will bring a great change in the packaging industry.

关 键 词：键合 内引线 欧姆接触 热压焊接 超声波焊接热 超声键合 

分 类 号：TN405.96[电子电信—微电子学与固体电子学]