与CMOS-SEED灵巧象素相关的倒装焊工艺  

Flip Chip Bond Technique Related to CMOS SEED Smart Pixels

作　　者：李献杰[1] 曾庆明[1] 蔡克理[1] 敖金平[1] 赵永林[1] 焦智贤 王全树[1] 郭建魁[1] 

机构地区：[1]河北半导体研究所专用集成电路国家级重点实验室

出　　处：《半导体情报》1999年第1期37-40,共4页Semiconductor Information

摘　　要：介绍了新型ＣＭＯＳ－ＳＥＥＤ灵巧象素结构原理及相关的倒装焊技术，采用厚光致抗蚀剂作掩模，通过磁控溅射和真空蒸发相结合，解决了与ＣＭＯＳ－ＳＥＥＤ有关的Ｉｎ凸点阵列成型等关键工艺，并用Ｍ８－Ａ型可视对准式倒装焊系统完成了ＣＭＯＳ电路芯片和ＳＥＥＤ阵列芯片的倒装焊。The structure of CMOS SEED smart pixels and the related flip chip bond technique were introduced.Using thick photo resist as a mask,indium solder bump array was manufactured through magnetic sputtering and vacuum vaporing method.As a result,the CMOS IC chip and SEED array chip were flip bonded by a M8 A visible align flip chip bonder system.

关 键 词：倒装焊 CMOS-SEED 半导体光电器件 凸点 

分 类 号：TN386.105[电子电信—物理电子学] TN360.5