硅MEMS器件加工技术及展望  

Processing Technology and Development of Silicon MEMS

作　　者：徐永青[1] 杨拥军[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《微纳电子技术》2010年第7期425-431,共7页Micronanoelectronic Technology

摘　　要：介绍了几种典型的硅基MEMS加工技术以及应用,并简单展望了MEMS加工技术发展趋势。硅基MEMS加工技术主要包括体硅MEMS加工技术和表面MEMS加工技术。体硅MEMS加工技术的主要特点是对硅衬底材料的深刻蚀,可得到较大纵向尺寸可动微结构,体硅工艺包括湿法SOG(玻璃上硅)工艺、干法SOG工艺、正面体硅工艺、SOI(绝缘体上硅)工艺。表面MEMS加工技术主要通过在硅片上生长氧化硅、氮化硅、多晶硅等多层薄膜来完成MEMS器件的制作,利用表面工艺得到的可动微结构的纵向尺寸较小,但与IC工艺的兼容性更好,易与电路实现单片集成。阐述了这些MEMS加工技术的工艺原理、优缺点、加工精度、应用等。提出了MEMS加工技术的发展趋势,包括MEMS器件圆片级封装(WLP)技术、MEMS工艺标准化、MEMS与CMOS单片平面集成、MEMS器件与其他芯片的3D封装集成技术等。Several typical silicon based MEMS processing technologies and applications are introduced,and the development tendencies of MEMS processing technology are prospected.The silicon based MEMS processing technology includes bulk silicon MEMS and surface processing technologies.The main characteristic of bulk silicon MEMS processing technology is deep etching of silicon substrates to obtain larger size and moving microstructure.Bulk silicon MEMS technologies include the wet SOG（silicon on glass ）process,dry SOG process technology,positive bulk silicon technology and SOI（silicon on insulator）technology.MEMS surface processing technology is mainly through silicon oxide growth,silicon nitride growth and polycrystalline silicon such multilayer films on the silicon to fabricate MEMS devices.The vertical size of the moving microstructure by the MEMS surface processing is small,but the MEMS surface processing compatibility with IC technology is better and easy to be a single integrated circuit.The principle,advantages and disadvantages,machining precision,and applications of MEMS processing technology are described.The development tendencies of MEMS processing technology are presented,including MEMS devices wafer package（WLP）technology,MEMS processing standardization,MEMS and CMOS monolithic integrated,MEMS devices with other chip 3D encapsulation integration technology,etc.

关 键 词：微电子机械系统 体硅工艺 表面工艺 穿硅通孔 3D封装 

分 类 号：TH703[机械工程—仪器科学与技术]