LCP基板在微波/毫米波系统封装的应用  

The Application of LCP Substrate for Microwave/Millimeter-Wave System Packaging

作　　者：曾策[1] 高能武[1] 林玉敏[1] 

机构地区：[1]中国电子科技集团公司第29研究所,成都610036

出　　处：《电子与封装》2010年第10期5-8,共4页Electronics & Packaging

摘　　要：液晶聚合物(LCP)在微波/毫米波频段内介电常数低,损耗小,并且其热稳定性高、机械强度大、吸湿率低,是一种适合于微波/毫米波电路应用、综合性能优异的聚合物材料。LCP基板可实现无源、有源器件的埋置和集成,且具有一定的气密特性,是一种具备实现系统级封装(SOP)能力的基板技术。文章系统地介绍了基于LCP材料基板的性能,并分析了相对于传统聚四氟乙烯(PTFE)基板的优势。还综述了近年来LCP基板作为微波/毫米波系统封装的研究进展,并指出LCP基板是一种具有良好发展前景的微波/毫米波系统级封装技术路线。LCP （Liquid Crystalline Polymer） is an excellent comprehensive high-performance polymer materials and suitable for microwave/millimeter-wave application for its low dielectric constant, low loss and high thermal stability, mechanical strength, low moisture absorption. Passive and active devices can be embedded in LCP substrate which has a ＂nearly hermeticity＂ characteristic. All above make LCP substrate to be a candidate for System on Package application. This paper discusses the superiority of LCP substrate systematically in the microwave/millimeter-wave application compared with conventional polytetrafluoroethylene. Furthermore, it reviews the recent research progress of LCP substrate as a microwave/millimeter-wave system packaging.

关 键 词：液晶聚合物 基板 微波 毫米波 

分 类 号：TN305.94[电子电信—物理电子学]