Al-Mg合金化学机械抛光的实验研究  

Experimental Study of Al-Mg Alloy Chemical Mechanical Polishing in Alkaline Condition

作　　者：徐文忠[1] 刘玉岭[1] 牛新环[1] 穆会来[1] 

机构地区：[1]河北工业大学微电子研究所,天津300130

出　　处：《半导体技术》2010年第12期1174-1177,共4页Semiconductor Technology

基　　金：国家自然科学基金资助项目(10676008);河北省教育厅科学研究计划项目(2007429)

摘　　要：将CMP技术用于Al-Mg合金表面加工中,根据抛光布特性及Al-Mg合金性质来选择抛光布。并从研究Al-Mg合金在碱性条件下化学机械抛光机理出发确定相应的抛光液,最后对Al-Mg合金化学机械抛光中pH值、压力、流量等主要参数进行优化实验。确定当压力为0.05 MPa,pH值为11.20,流量为250 ml/min时,Al-Mg合金表面状态良好。用美国ZYGO公司产的NewView6000非接触光学表面轮廓仪来测量表面粗糙度已达到纳米级别。CMP technology was extended to the surface processing of Al-Mg alloy.According to the features of polishing cloth and the nature of Al-Mg alloy,the polishing cloth was selected.And then the corresponding polishing solution was producted with the study of Al-Mg alloy chemical mechanical polishing in alkaline condition.Finally,three key polishing parameters of the pH,polishing pressure and slurry flow rate were optimized.The results of experiments indicate that the surface can be in a good condition when the pH value is 11.20,polishing pressure is 0.05 MPa,and the slurry flow rate is 220 ml/min.Through measureing the surface roughness with NewView 6 000,the result shows that it has reached the nanometer level.

关 键 词：化学机械抛光 抛光布 单因素法 表面状态 抛光液 

分 类 号：TN305.2[电子电信—物理电子学]