铝碳化硅复合材料镀覆技术研究  

The Research on AISiC Composite Material Electroplating Technology

作　　者：徐东升[1] 杨鹏飞[1] 田晓忠[1] 黄平[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230022

出　　处：《混合微电子技术》2010年第4期36-40,共5页Hybrid Microelectronics Technology

摘　　要：铝碳化硅复合材料是一种导热率高、材质轻、热匹配性好的电子封装材料。铝碳化硅复合材料内部包含金属铝、碳化硅陶瓷颗粒，镀覆技术难度大。本文主要阐述Al／SiC复合材料的镀前处理、镀覆工艺与镀层热处理技术，以及实用化封装外壳产品应用。复合材料的镀层采用化学镍、镍、金复合镀层结构，能够满足400℃、15分钟的高温考核，并能够满足封装外壳的焊接密封性要求。AlSiC is a metal matrix composite composed of silicon carbide ceramic particles and an aluminum alloy. The material features high thermal conductive, lightweight and low coefficient of thermal expansion. The article mainly describes pretreatment process of the composite surface, electroless Ni - P alloy plating process, eleetroplating and heat treatment also with its application. The plating layer structure of the composite is made of electroless plating Ni, plating Ni and Au compound plating layer. It can meet the requirements of high temperature at 400℃ with 15 minutes and also with the hermetic sealing requirements of packaging.

关 键 词：封装 AL/SIC复合材料 镀覆 镀前处理 

分 类 号：TB333[一般工业技术—材料科学与工程]