平行缝焊工艺抗盐雾腐蚀技术研究  

Study on Anti-Spray-Salt Corrosion for Seam Sealing of Hermetic Packaged IC

作　　者：李茂松[1] 何开全[1] 徐炀[1] 张志洪[1] 

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2011年第3期465-469,共5页Microelectronics

摘　　要：抗盐雾腐蚀是提高集成电路封装可靠性的重要手段之一。根据金属腐蚀机理,通过优化封焊工艺和AuSn合金焊料平行缝焊封盖工艺,以及在封盖后再次进行电镀修复损伤等措施,提高了平行缝焊集成电路的抗盐雾腐蚀能力。Anti-spray-salt corrosion is one of the mostly used approaches to improving reliability of IC packages.Based on mechanism of metal corrosion,novel methods for seam sealing of hermetic packaged ICs using improved welding process,seam sealing of lids with AuSn alloy solder and re-plating after packaging to repair damaged welding lines were proposed to improve anti-spray-salt performance of hermetic packaged IC＇s by parallel seam sealing.

关 键 词：集成电路封装 抗盐雾腐蚀 平行缝焊 

分 类 号：TN305.94[电子电信—物理电子学]