微机械加工中的图形硅片键合技术  

Bonding Technology for Silicon Wafer with Patterns in the Process of Micromachine

作　　者：陈德英[1] 茅盘松 袁璟 

机构地区：[1]东南大学微电子中心,南京210096

出　　处：《固体电子学研究与进展》1999年第3期321-328,共8页Research & Progress of SSE

基　　金：国防科工委"九五"预研项目

摘　　要：重点介绍了在微机械加工中碰到的带图形硅片键合工艺，测量了不同表面处理和不同退火条件下的表面能，估算了封闭腔内的剩余压力和腔体薄壁的形变。This paper introduces the bonding technology for silicon wafer with patterns in the process of micromachine. The surface energy are measured for different surface processings and annealing conditions. The residual pressure of sealed cavity and the deformation of thin wall for cavity are also evaluated. This work is of great importance for reseaching and developing the novel micromachine structures.

关 键 词：微机械加工 图形硅片键合 封装 半导体器件 

分 类 号：TN305.94[电子电信—物理电子学]