MCM-C/D微波基板工艺技术研究  

Technology of MCM-C/D in Microwave Circuit Substrate

作　　者：胡骏[1] 柳龙华[1] 

机构地区：[1]中国电子科技集团第38研究所,安徽合肥230088

出　　处：《电子工艺技术》2011年第5期288-290,共3页Electronics Process Technology

摘　　要：提出了一种新型的MCM-C/D微波基板研制方法,克服了低温LTCC基板微带线耐焊性差及附着力差的缺点。研究了MCM-C/D基板的膜层结构特征及制作过程的工艺控制方法,并给出相应的试验结果,这对于微波电路基板的设计和应用有一定的参考价值。A new method of MCM-C/D in microwave circuits has been introduced.This method can overcome the disadvantages of microstrip on the LTCC substrate such as times of soldering and adhesion.The fabrication technologies and the method of control in the process in MCM-C/D substrate have been studied.The experimental results are given.It is of important referenced values for design and application of microwave circuits.

关 键 词：低温共烧陶瓷 多芯片组件 耐焊性 附着力 

分 类 号：TN605[电子电信—电路与系统]