添加Sb和LaB_6对Sn3.0Ag0.5Cu/Cu界面IMC生长的影响  

Effect of Sb and LaB_6 Addition on the Growth of Intermetallics in Sn3.0Ag0.5Cu/Cu Solder Joints

作　　者：龙琳[1] 陈强[1] 廖小雨[1] 李国元[1] 

机构地区：[1]华南理工大学电子与信息学院,广州510640

出　　处：《半导体技术》2012年第1期42-46,73,共6页Semiconductor Technology

摘　　要：研究了Sb和稀土化合物的添加对Sn3.0Ag0.5Cu无铅焊料焊接界面金属间化合物层生长的影响。研究结果表明,固态反应阶段界面化合物层的生长快慢排序如下:v(SAC0.4Sb0.1LaB6/Cu)<v(SAC0.4Sb/Cu)<v(SAC0.1LaB6/Cu)<v(SAC/Cu)。计算各种界面IMC生长的激活能Q结果表明,Sn3.0Ag0.5Cu/Cu界面IMC生长的激活能最高,为92.789 kJ,其他焊料合金Sn3.0Ag0.5Cu0.4Sb0.1LaB6/Cu,Sn3.0Ag0.5Cu0.1LaB6/Cu和Sn3.0Ag0.5Cu0.4Sb/Cu界面IMC生长的激活能分别为85.14,84.91和75.57 kJ。在老化温度范围内(≤190℃),Sn3.0Ag0.5Cu0.4Sb0.1LaB6/Cu的扩散系数(D)最小,因而其界面化合物的生长速率最慢。Effects of Sb and rare earth element compound addition on the intermetallic compound gxowth in lead-free solder joints was investigated. Results show that for solid reaction, IMC growth rate has a rank of v（ SAC0.4Sb0. ILaB6/Cu） 〈 v（SAC0.4Sb/Cu） 〈 v（ SAC0. 1LaB6/Cu） 〈 v（SAC/Cu） for the alloy systems. Activation energy of IMC growth was determined. Results show that IMC growth in Sn3.0Ag0.5Cu/Cu solder joint has maximum activation energy of 92. 789 kJ. Other three activation energies are 85. 14, 84.91 and 75.57 kJ for Sn3.0AGO. 5CuO. 4Sb/Cu, Sn3. OAg0.5Cu0. 1LaB6/Cu and Sn3.0Ag0.5Cu0.4Sb0. 1LaB6/Cu solder joints, respectively. Among four alloys, Sn3.0AGO. 5Cu0. 4Sb0. 1LaB6/Cu has the smallest diffusion constant D, hence it has the minimum interdiffusion coefficient in the range of the aging temperature （ ≤ 190 ℃ ）.

关 键 词：无铅焊料 稀土 润湿性 互扩散系数 电子封装 

分 类 号：TG425[金属学及工艺—焊接]