气密性金属封装内的水汽及气氛研究  

Investigation into Moisture & Atmosphere in Hermetic Metal Package

作　　者：谈侃侃[1] 李双江[1] 李金龙[1] 

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2012年第3期432-435,共4页Microelectronics

摘　　要：从封装管壳、贴片材料、固化烘烤处理方式等方面,研究了封装内部的水汽和气氛。结果表明,管壳清洗后烘焙的水汽含量低于清洗后不烘焙的水汽含量。粘结材料(环氧树脂、氰酸酯树脂等)吸附于器件表面,其排放对封装内的水汽有严重的影响。对于环氧树脂H35和氰酸酯树脂JM7000两种导电胶,烘焙后的效果要好于未烘焙,且随着烘焙时间的延长,水汽含量逐步降低。对外壳清洗后进行150℃/8h的烘焙,对水汽和气氛都有好处。由于储能焊对导电胶的热冲击不大,两种导电胶的水汽和气氛排放并无明显差别。Moisture and atmosphere inside IC packages were investigated in terms of package case, die-attachment ma terials, curing and baking. It has been shown that moisture content in packages baked after cleaning was lower than those without baking, and moisture admrbed by epoxy resin, cyanate ester resin and package surface had a significant impact on moisture content in packaging.. For conductive adhesives, H35 and JM7000, treatment with baking was better than treat- ment without baking, and moisture content decreased with baking time A 150℃ / 8 h baking after cleaning was good for reducing moisture and atmosphere in packaging. Due to faint heat concussion of stored energy welding, no significant differ- ence in moisture and atmosphere was observed between the two conductive adhesives.

关 键 词：气密性封装 金属封装 水汽 气氛 

分 类 号：TN305.94[电子电信—物理电子学]