用于大功率半导体激光器的Ag-In焊料研究  

Ag-In Solder Research for High-power Semiconductor Laser

作　　者：程东明[1] 伏桂月[1] 朱飒爽[1] 王永平[1] 

机构地区：[1]郑州大学物理工程学院电子科学与技术系,郑州450001

出　　处：《电子与封装》2012年第7期1-3,共3页Electronics & Packaging

摘　　要：大功率半导体激光器的封装对焊料选择极其重要,因为焊料导热或导电性差,激光器工作产生的大量热量使焊料焊接失效,激光器也会遭到损坏。为此,文中研究了软焊料In及其保护层Ag作为一种焊料组合,通过真空蒸发镀膜仪蒸发蒸镀Ag-In与Ag-In-Ag-In两种薄膜方式。根据微结构知识及扩散动力学与热动力学相结合讨论了Ag-In焊料产生间隙的原因,通过XRD衍射仪了解到薄膜间界面化合物AgIn2的生成可能导致表面微结构的改变,结果表明Ag层对In层易被氧化的性质起到了保护作用,多层的Ag-In焊料层可抑制大量间隙的产生,提高器件工作可靠性及稳定性。High-Power semiconductor laser package for choosing solder is very important, because a lot of heat generated by the work of the solder thermal conductivity or electrical conductivity is poor, laser solder joint failure and will be damaged. So, we studied the soft solder In and the protective layer of Ag as a solder combination, by the vacuum evaporation coating apparatus we evaporated to deposition of Ag-In and Ag-In-Ag-In two films. According to the micro-structure of knowledge and diffusion kinetics and thermal dynamics, we discussed the reason of the Ag-In solder gap and by the XRD we learned that the interface compound Ag-In2 generated might lead to the change of surface micro-structure, the results showed that the nature of the Ag layer played a protective role on the In layer easily oxidized, and multiple layers of Ag-In solder can inhibit the production stability of the device operation.

关 键 词：焊料 Ag-In薄膜 封装 

分 类 号：TN248.4[电子电信—物理电子学]