无铅焊料的蠕变行为研究进展  

Advances in Research of Creep Behavior of Lead-free Solders

作　　者：张文斐[1,2] 安兵[1,2] 柴駪[1,2] 吕卫文[1,2] 吴懿平[1,2] 

机构地区：[1]华中科技大学材料学院,湖北武汉430074 [2]武汉光电国家实验室,湖北武汉430074

出　　处：《电子工艺技术》2012年第4期193-198,225,共7页Electronics Process Technology

基　　金：国家自然科学基金项目(项目编号:No.60976076和No.60876070)

摘　　要：无铅焊料已经逐渐代替锡铅焊料广泛应用于电子产品连接技术。但其在环境中的物理和机械性能,尤其是蠕变性能却低于锡铅焊料合金,成为无铅焊料可靠性的主要问题。综述了近些年来无铅焊料蠕变性能的研究,包括蠕变机制、蠕变本构方程、焊点尺寸、无铅合金成分、金属间化合物以及微观组织结构对蠕变性能影响等主要研究热点,并对此领域的发展做出了展望。Lead-free solders have replaced Pb-Sn solders to be widely used in electronics interconnect technology.The main problem of lead-free solders responsibility is their physical and mechanical properties,especially creep resistance,are poorer than Pb-Sn solders.Review the research development of creep behavior of lead-free solders in recent years,in views of several research hot points,including creep mechanism creep constitutive equation,the effects on creep properties of joints size and solder composition.After that,the research trend in this area is forecasted.

关 键 词：无铅焊料 蠕变 倒装芯片 BGA 

分 类 号：TN60[电子电信—电路与系统]