湿法刻蚀及其均匀性技术探讨  

Wet etch and its uniformity technical discuss

作　　者：段成龙[1] 舒福璋[1] 宋伟峰[1] 关宏武[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京101601

出　　处：《清洗世界》2012年第11期33-36,共4页Cleaning World

摘　　要：湿法刻蚀是化学清洗方法之一,是一种在半导体制造过程中被广泛应用的工艺,具有对器件损伤小、设备简单等特点。本文介绍了湿法刻蚀工艺的原理、工艺过程以及应用,分析了影响湿法刻蚀均匀性的主要因素,并提出提高刻蚀均匀性的方法。Wet etch is a kind of chemic r/nse process, which is used widely in the area of semiconduc- tor produce. This process has several virtues, such as little scathe, simple equipment, and so on. The text expounds the process principle, and its application, analyses the central complication of affecting the etch uniformity, and puts forward the method of advancing etch uniformity.

关 键 词：湿法刻蚀 刻蚀工艺 刻蚀均匀性 半导体制造 

分 类 号：TN305[电子电信—物理电子学]