一种集成式硅MEMS振动陀螺仪  

An Integrated Silicon MEMS Vibration Gyroscope

作　　者：李博[1] 杨拥军[1] 徐永青[1] 徐淑静[1] 胥超[1] 何洪涛[1] 罗蓉[1] 卢新艳[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《微纳电子技术》2013年第8期501-505,共5页Micronanoelectronic Technology

摘　　要：介绍了一种集成式硅MEMS振动陀螺仪。首先阐述了MEMS振动陀螺仪的工作原理;在此基础上,介绍了陀螺敏感结构形式:采用双端固定音叉结构,差分检测,实现对外界角速率的敏感,给出了结构设计和有限元(FEM)仿真结果;加工工艺采用圆片级真空封装SOI工艺,介绍了工艺流程;检测电路采用数字化ASIC电路,给出了电路原理框图;采用LCC30陶瓷外壳实现了陀螺的集成封装。最后介绍了陀螺的研制结果和典型参数,陀螺量程达到±500°/s,零偏稳定性和重复性达到5°/h,标度因数非线性为1.5×10-4,重复性为5×10-5,重量仅为1.85 g,功耗为0.125 W,可满足大部分工程应用要求。An integrated silicon MEMS vibration gyroscope was introduced. The working principle of the MEMS vibration gyroscope was expounded. The sensitive structure of the MEMS gyro- scope was described. The sensitivity of outside angular rate was realized with the double ended tuning fork （DETF） structure and differential detection. The structure design and finite element modeling （FEM） simulation result were given. The wafer level vacuum package SOI process was used in the process, and the process flows were introduced. The digitization ASIC was used in the detection circuit, and the principle diagram of the circuit was presented. The integrated pac- kage of the gyroscope was realized with the LCC30 ceramic package housing. In the end, the result and the typical parameters were introduced. The range reaches ±500°/s, bias stability and bias repeatability are 5°/h, scale factor nonlinearity is 1.5×10^-4, scale factor repeatability is 5 ×10^-5 , weight is only 1.85 g, and power consumption is 0. 125 W, which can meet the application requirements for most of the engineerings.

关 键 词：微电子机械系统(MEMS) 陀螺仪 SOI工艺 圆片级真空封装 集成封装 专用集成电路(ASIC) 

分 类 号：TH703[机械工程—仪器科学与技术]