LED用蓝宝石衬底抛光技术进展  

The Progress on Polishing Technology of Sapphire Substrate Used in LED

作　　者：卓志国[1,2] 周海[2] 徐晓明[1,2] 臧跃[2,3] 

机构地区：[1]常州大学,江苏常州213016 [2]盐城工学院,江苏盐城224051 [3]江苏大学,江苏镇江212013

出　　处：《机械设计与制造》2013年第4期249-251,255,共4页Machinery Design & Manufacture

基　　金：江苏省自然科学基金项目(BK2008197);江苏省高校科研成果产业化推进项目(JH10-X048);江苏省"青蓝工程";江苏省新型环保重点实验室开放课题基金(AE201120);江苏省生态环境材料重点建设实验室开放课题资助(EML2012013)

摘　　要：蓝宝石单晶衬底具有优秀的物理化学性质,作为LED的主要衬底材料,其晶片表面质量要求非常高,而加工工艺在很大程度上决定了表面质量。对蓝宝石衬底加工的各种工艺原理作简要介绍,如化学机械抛光、磁流变抛光、浮法抛光等,指出这些加工方法的优缺点、发展进程等。目前蓝宝石衬底的抛光质量已经达到:表面粗糙度0.1nm,平面度0.5μm。随着生产工艺的不断进步,数字化、全自动、绿色无污染的抛光工艺是未来蓝宝石衬底加工的发展方向。The sapphire contains excellently physical and chemical properties,so it suits for being the substrate of LED.It is known that the substrate must have very smooth surface,such as low roughness and high forming;however,the surface quality depends on the process technique.It introduces some processing technique such as CMP,magneto-rheological finishing,float polishing and their merit,demerit and developing.Now the highest processing quality of sapphire surface obtained is that the Ra is 0.1nm,flatness is 0.5μm.With the advance of processing technique,digitized,full automatic,green polishing techniques will come true.

关 键 词：蓝宝石衬底 抛光工艺 化学机械抛光 

分 类 号：TH16[机械工程—机械制造及自动化] TG878.1[金属学及工艺—公差测量技术]