双轴式研磨抛光中抛光盘相对位置对去除量的影响研究  

Study on the influence of the relative position of the polishing pad to the removal quantity in two-axis lapping/polishing mode

作　　者：张杨[1] 李秀龙[1] 徐清兰[2] 张蓉竹[1] 

机构地区：[1]四川大学电子信息学院,成都610064 [2]中国科学院光电技术研究所,成都610209

出　　处：《光学技术》2013年第5期408-412,共5页Optical Technique

基　　金：国家重大专项应用基础项目(GFZX020010803.22)

摘　　要：为了了解在抛光过程中抛光盘位置对光学元件面形的影响,对一种双轴式平面研磨抛光运动过程进行了分析。从Preston方程出发,推导了去除函数的表达式,研究了抛光盘的摆幅及偏心距离对元件的去除量分布的影响。通过定量计算得知,在加工转速不变的情况下,增大抛光盘的摆幅,元件不同圆周上的去除量也不同。增大偏心距,元件的去除量增大,不论抛光盘相对元件的位置如何改变,回转中心的去除量总是最大。In order to understand the effect of the position of polishing pad on the surface shape of the optical element during the polishing progress, the movement process of two-axis lapping/polishing is reviewed. The removal function is derived based on the Preston equation. On the basis, the influence on the distribution of the removal quantity of the pads swing and eccentric distance are researched. The result of quantitative calculation shows that, under a constant rotational speed, the removal on different circumferences of the workpiece changes along with the polishing swing increases. The removal of workpiece raises via increasing eccentricity, moreover the removal of center of rotation always stays the lar gest, regardless of the change of relative position between polishing and the workpieee.

关 键 词：平面研磨 去除函数 抛光盘摆幅 偏心距 去除量 

分 类 号：TS934.3[轻工技术与工程]