电子封装SnPb钎料和底充胶的材料模型及其应用  

MATERIAL MODELS FOR SnPb SOLDERS AND UNDERFILL IN ELECTRONIC PACKAGING AND THEIR APPLICATION

作　　者：王国忠[1] 陈柳[1] 程兆年[1] 

机构地区：[1]中国科学院上海冶金研究所,上海200050

出　　处：《机械工程学报》2000年第12期33-38,共6页Journal of Mechanical Engineering

摘　　要：采用统一型粘塑性Ａｎａｎｄ模型描述ＳｎＰｂ针料的非弹性力学行为，基于试验数据和弹塑性蠕变本构模型，确定了９２．５Ｐｂ５Ｓｎ２．５Ａｇ和６０Ｓｎ４０Ｐｂ两种钎料Ａｎａｎｄ模型的材料参数。采用线性粘弹性Ｍａｘｗｅｌｌ模型，描述了一种倒装焊底充胶Ｕ８３４７－３材料的模量松弛和体积松弛，得到了相应的松弛参数，研究对所给出的材料模型和参数进行了验证。另外，利用有限元法模拟了倒装焊在热循环条件下的应力应变行为，分析了ＳｎＰｂ焊点的塑性应变和热循环寿命。结果表明，采用上述材料模型和参数，可以合理描述ＳｎＰｂ钎料和底充胶的力学本构，并可应用于电子封装的可靠性模拟和分析。The unified viscoplastic Anand model is employed to represent the inelastic deformation behavior of SnPb solders. Based on the eXPerimental data and the elsto-plasto-creep model, the material parameters of Anand model for 92. 5Pb5Sn2. 5Ag and 60Sn40Pb solders are determined. The linear viscoelastic Maxwell model is applied to describe the modulus and volume relaxation of a underfill material U8347-3 in flip chip package and the relaxation coefficients are obtained. In addition, the stress/strain resPOnses of flip chip package under thermal cycling are simulated with finite element method. The viscoplastic strain and thermal fatigue lifetimes of SnPb solder joints are analyzed. The results show that the viscoplastic Anand and the linear viscoelastic Maxwell models can be used to represent the mechanical behaviors of SnPb solders and under fill material, respectively. The material models can be applied to the reliability simulation and analysis of electronic packages.

关 键 词：SnPb钎料 底充胶 材料模型 倒装焊 电子封装 

分 类 号：TG425[金属学及工艺—焊接] TN305.93[电子电信—物理电子学]