基于多层PCB布线的Ku波段TR组件的设计  

A Ku Wave Band TR Module Design Based on the Multilayer Arrangement of Wire in PCB

作　　者：胡仕伟[1] 方圆[1] 钱志宇[1] 

机构地区：[1]中国电子科技集团公司第55研究所,南京210016

出　　处：《电子与封装》2013年第11期28-32,共5页Electronics & Packaging

摘　　要：多层板布线技术作为一种重要的组件小型化的技术,应用越来越广泛,通过此技术,可以将TR组件的尺寸做到更小,重量更轻。文章介绍了多层PCB布线技术的相关知识,并利用此技术针对一个Ku波段的TR组件给出了相应的结构设计、电路设计和工艺设计,并最终测得发射端功率输出大于10 W,杂散抑制40 dB左右;接收端接收总增益大于100 dB,噪声系数小于4 dB。As an important way of minimizing TR module, the multilayer arrangement of wire has been applied more and more widely. The paper presents the related knowledge of multilayer arrangement of wire in PCB. With this technology, a Ku waveband TR module has been designed, including the structure design, the circuit design, and the fabrication technique design. In the end, the TR module has an output power of 10 W, about 40 dB noise wave suppression, and more than 100 dB total gain, less than 4 dB noise figure.

关 键 词：小型化 多层板 KU波段 TR组件 

分 类 号：TN402[电子电信—微电子学与固体电子学]