倒装焊SnPb焊点热循环失效和底充胶的影响  

Thermal Cycle Failure of Sn Pb Solder Jointfor Flip Chip Package and Effects of Underfill Material

作　　者：陈柳[1] 张群[1] 王国忠[1] 谢晓明 程兆年[1] 

机构地区：[1]中国科学院上海冶金研究所电子封装联合实验室,上海200050

出　　处：《Journal of Semiconductors》2001年第1期107-112,共6页半导体学报（英文版）

摘　　要：采用实验方法 ,确定了倒装焊 Sn Pb焊点的热循环寿命 .采用粘塑性和粘弹性材料模式描述了 Sn Pb焊料和底充胶的力学行为 ,用有限元方法模拟了 Sn Pb焊点在热循环条件下的应力应变过程 .基于计算的塑性应变范围和实验的热循环寿命 ,确定了倒装焊 Sn Pb焊点热循环失效 Coffin- Manson经验方程的材料参数 .研究表明 ,有底充胶倒装焊 Sn Pb焊点的塑性应变范围比无底充胶时明显减小 ,热循环寿命可提高约 2 0倍 。The thermal cycle lifetim es of Sn Pb solder joints for flip chip package were determined experim entally. With vis- coplastic and viscoelastic materials representing the mechanical behavior of Sn Pb solder and underfill,respectively,the stress/ strain responses of Sn Pb solder joints under thermal cycling with finite element method are simulated.Based on the calculated plastic strain ranges and the experim ental therm al cycle lifetim es,the material constants in Coffin- Manson empirical equation were then obtained.The results show that,the plastic strain ranges of solder joints with underfill decrease distinctly and the thermal cycle lifetim es are approxim ately2 0 times larger than that in the case without underfill.Moreover,the influences of solder joint height on solder joint reliability are weakened for the flip chip package with underfill.

关 键 词：倒装焊 SNPB焊点 底充胶 热循环 有限元模拟 封装 电子器件 

分 类 号：TN405[电子电信—微电子学与固体电子学]