聚酰亚胺隔热悬挂结构设计与制作  

Design and fabrication of polyimide adiabatic suspension structure

作　　者：李绍良[1,2] 徐静[1] 吴亚明[1] 

机构地区：[1]中国科学院上海微系统与信息技术研究所传感技术联合国家重点实验室,上海200050 [2]中国科学院大学,北京100049

出　　处：《传感器与微系统》2014年第5期91-94,98,共5页Transducer and Microsystem Technologies

基　　金：中国科学院知识创新工程重要方向性项目(KGCX2-YW-143)

摘　　要：加热器在原子钟、气体传感器、生物传感器等器件中有着广泛的应用,降低加热功耗对于这些器件的实用化具有重要意义。设计并制作了一种集成了加热器和温度传感器的聚酰亚胺隔热悬挂结构,用于承载待加热的芯片,并利用集成制作在聚酰亚胺膜上的2组Pt线圈分别对芯片进行加热和温度检测。实验证明:聚酰亚胺隔热悬挂结构由热传导引起的功耗仅为没悬挂结构时的0.95%,大大降低了由热传导引起的功耗,即便在没有真空封装的情况下,在芯片工作在100℃时,功耗也可降低到36.7%;同时该结构也具有良好的机械性能,承载体积为14 mm×7 mm×1 mm的硅基芯片时,安全系数可达到56.58,具有很好的应用前景。Heater has played important roles in the field of atomic clock, gas sensor, biosensor and so on. The power consumption reduction of these devices has great practical significances. A adiabatic suspended structure is designed and fabricated, and heater and temperature sensor are designed on the polyimide membrane to heat the chip and measure the temperature. Experimental results show that the power consumption caused by thermal conductivity of the polyimide adiabatic suspension structure is only 0.95 % compared to the case without adiabatic suspension structure, therefore it can greatly reduce the power consumption caused by thermal conductivity, even in the case without vacuum encapsulation, the power consumption can also be reduced to 36. 7 % when the temperature of chip maintains at 100 ℃ ; meanwhile the structure also has very good mechanical properties, when carrying a silicon chip with volume of 14 mm ×7 mm ×1 mm, the safety factor can be up to 56.58, therefore it has a great promising application prospect.

关 键 词：聚酰亚胺 隔热悬挂结构 MEMS技术 低功耗 绝热封装 

分 类 号：TP303[自动化与计算机技术—计算机系统结构]