Pyrex 7740玻璃深刻蚀掩模研究  

Research on pyrex 7740 glass deep etching mask

作　　者：王伟康[1] 苑伟政[1] 任森[1] 邓进军[1] 孙小东[1] 

机构地区：[1]西北工业大学空天微纳系统教育部重点实验室,陕西西安710072

出　　处：《传感器与微系统》2014年第6期15-18,共4页Transducer and Microsystem Technologies

摘　　要：玻璃湿法深刻蚀掩模常采用低压化学气相沉积(LPCVD)多晶硅、Cr/Au金属层+光刻胶等,但往往会在玻璃中引入应力,影响后期应用(如阳极键合),而且Cr/Au金属层价格昂贵。为避免以上缺点,引入了SX AR—PC 5000/40保护胶+WBR2075干膜作为玻璃的刻蚀掩模,在HF︰NH4F,HF︰HCl,HF︰HCl︰NH4F刻蚀溶液中进行了大量实验。实验结果表明:SX AR—PC 5000/40抗腐蚀能力强,且成功实现了对Pyrex 7740玻璃131μm的深刻蚀。整个工艺过程与IC工艺兼容,可以进行圆片级批量加工。实验结果对圆片级封装和其他MEMS器件的制作有一定参考作用。Glass wet deep etching mask often uses LPCVD poly-silicon or Cr/Au metal layer combined with photoresist ,which will induce stress in glass and affect the late application such as anodic bonding. Besides, Cr/Au is expensive. In order to avoid above shortcomings, protective coating SX AR-PC 5000/40 combined with WBR2075 dry film is introduced as a new etching mask. Lots of experiments are investigated in HF ： NH4 F, HF： HCl,HF： HCl： NH4F etching solution. It is shown by the experiments that SX AR-PC 5000/40 has strong resistance to corrosion,and deep etching on pyrex7740 glass of depth of 131 μm is obtained. The whole process is compatible with standard IC process and can be batch fabricated at wafer-level. Experimental result has reference function for fabrication of some MEMS device, and wafer-level package.

关 键 词：Pyrex7740玻璃 湿法腐蚀 刻蚀掩模 微机电系统 

分 类 号：TN305.7[电子电信—物理电子学]