铜基引线框架材料的研究与发展  

Trends and development of copper alloys for lead frame

作　　者：马莒生[1] 黄福祥[1] 黄乐[1] 耿志挺[1] 宁洪龙[1] 韩振宇[1,2,3,4] 

机构地区：[1]清华大学材料科学与工程系,北京100084 [2]铜合金 [3]高强度 [4]高导电

出　　处：《功能材料》2002年第1期1-4,共4页Journal of Functional Materials

摘　　要：引线框架材料是半导体元器件和集成电路封装的主要材料之一，其主要功能为电路连接、散热、机械支撑等。随着ＩＣ向高密度、小型化、大功率、低成本方向发展，集成电路Ｉ／Ｏ数目增多、引脚间距减小，对引线框架材料提出了高强度、高导电、高导热等多方面性能上的要求。由于拥有良好的导电导热性能，铜合金已成为主要的引线框架材料。本文对电子封装铜合金引线框架材料的性能要求、国内外研究与发展等进行了综述。Lead frames are one of the most important component parts of discrete and IC devices, which provide electrical interconnection to the board, heat dissipation for the IC devices and mechanical support for the device and the package. With the development of IC to high density?miniaturization?low cost, the count of I/O increased, lead pitch decreased, which demand high strength?high conductivity for lead frame materials. Because of their good electrical and conductivity and cost, copper alloys for lead frames were widely used in IC packages. In this paper, the requirement, research and development are summarized with respect to copper lead frame materials.

关 键 词：引线框架材料 铜合金 电子封装 半导体器件 集成电路 

分 类 号：TN305.93[电子电信—物理电子学] TG146.11[一般工业技术—材料科学与工程]