引线框架铜合金氧化特性的研究现状  

The status and development of oxidation of copper alloy for lead frame

作　　者：黄福祥[1] 马莒生[1] 宁洪龙[1] 黄乐[1] 韩振宇[1] 徐忠华[1] 

机构地区：[1]清华大学材料科学与工程系,北京100084

出　　处：《功能材料》2002年第1期29-32,共4页Journal of Functional Materials

摘　　要：铜合金由于具有优良的导电导热性能，已在现代集成电路塑料封装中占据了引线框架材料８０％的份额。但铜合金容易氧化，其氧化膜被认为是塑料封装再流焊工艺中的分层和裂纹的主要原因之一，因此引线框架铜合金的氧化特性引起了人们的广泛注意。为获得铜合金引线框架良好的可靠性，不少材料工作者对铜合金在塑料封装中的氧化特性及其对铜合金与环氧树脂模压料（ＥＭＣ）的粘接强度的影响进行了研究，为此，本文对引线框架铜合金的氧化物结构及动力学、铜合金与环氧树脂模塑料（ＥＭＣ）粘接强度的影响因素等领域的研究进行了综述。The lead frame share of copper alloys has increased to roughly 80% of total market due to their excellent thermal and electrical performance. Recently much more attention has been paid to adherence of the oxide film to the copper alloy lead frame substrate because this is thought to be related with crack or delamination of package that occurs in assembly process. A few materials researcher investigated the oxidation of copper alloys and its effect to adhesion of copper and epoxy molding component (EMC). In this paper, the structure and dynamics of copper alloy for lead frame, influence of adhesion of copper alloys and EMC are summarized.

关 键 词：塑料封装 铜合金 引线框架 氧化 粘接强度 集成电路 

分 类 号：TN405[电子电信—微电子学与固体电子学] TG146.11[一般工业技术—材料科学与工程]