球栅阵列倒装焊封装中的热应变值的测试  

Measuring Method in Thermal Strain of Flip Chip Package with Solder Joints

作　　者：李禾[1] 傅艳军[1] 李仁增[1] 严超华[1] 

机构地区：[1]南昌航空工业学院实验力学研究室,南昌330034

出　　处：《Journal of Semiconductors》2002年第6期655-659,共5页半导体学报（英文版）

摘　　要：利用高温云纹实验方法测试球栅阵列 (BGA)封装焊点的热应变 ,采用硅橡胶试件光栅复制技术 ,使测试环境温度提高到 2 0 0℃ .通过实时热应变测量 ,得到各焊点的热应变关系以及封装材料、电路板各部分的热应变分布状况 。A replicating technology with silica gel is studied by testing the advanced BGA package of the thermal strain through the moiré interferometry experiment in a high temperature and the thermal strain can be tested from room temperature to 200℃.By measuring the thermal strain in real time,the situation of all the soldering sections,and the packing materials are obtained.At the same time,the circuit board distribution of every thermal can be obtained,too.This research provides significant experimental data for studying the packing subassembly of soldering points of integrated circuit of modeling and the thermal fatigue destroying mechanism.

关 键 词：球栅阵列 倒装焊 封装 热应变值 测试 高温云纹 热疲劳 BGA 

分 类 号：TN305.93[电子电信—物理电子学]