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作 者:蔡金勇[1] 周琦[1] 罗小蓉[1] 陈万军[1] 范远航[1] 熊佳云 魏杰[1] 杨超[1] 张波[1]
机构地区:[1]电子科技大学电子薄膜与集成器件重点实验室,成都610054
出 处:《固体电子学研究与进展》2014年第5期409-414,共6页Research & Progress of SSE
基 金:国家自然科学基金资助项目(61234006;61306102);国家科技重大专项资助项目(2013ZX02308-005)
摘 要:提出一种复合沟道氟离子(F-)增强型AlGaN/GaN HEMT(Hybrid-channel enhancement-mode AlGaN/GaN HEMT,HCE-HEMT)新结构。该结构引入高、低浓度F-复合沟道,其中高浓度F-注入区位于沟道靠近源漏两端以调制阈值电压,获得增强型器件;低浓度F-区位于沟道中部以调制肖特基栅电极的正向开启电压,增加器件承受的栅电压摆幅,但它对其下方二维电子气的耗尽作用很弱。同时,高浓度区只占栅长的40%,减轻高浓度F-对沟道的影响,提升器件的电流能力。利用Sentaurus软件仿真,结果显示,与传统F-增强型AlGaN/GaN HEMT相比,HCE-HEMT载流能力提高了40.3%,比导通电阻下降了23.3%,同时反向耐压仅下降了5.3%。A novel hybrid-channel enhancement-mode AlGaN/GaN HEMT(HCE-HEMT)is proposed and investigated.The hybrid channel comprises both high concentration F-and low concentration F-,while the high concentration F-is located at both sides of the gate-controlled channel to modulate the threshold voltage of the device,resulting in a normally-off AlGaN/GaN HEMT.Meanwhile,the low concentration F-is seated in the middle of gate-controlled channel to suppress the gate forward leakage current.Due to the low concentration F-,the 2DEG under this region is weakly depleted.Moreover,the length of the high concentration F-region is optimized to be only 40%of gate length for alleviating influence of high concentration F-on channel.The simulation results show that maximum drain current density is improved by 40.3% with corresponding reduction of specific on-resistance by 23.3%in the proposed device,compared with conventional F-implanted enhancement-mode AlGaN/GaN HEMT. Furthermore, the breakdown voltage is only decreased by 5.3%.
关 键 词:氮化镓 异质结场效应管晶体管 增强型 复合沟道
分 类 号:TN386[电子电信—物理电子学]
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