面阵列凸点按需喷射打印平台控制  

Plane array package interconnect bump drop-on-demand printing platform control system

作　　者：高胜东[1] 刘荣辉[1] 姚英学[1] 

机构地区：[1]哈尔滨工业大学机电工程学院,哈尔滨150001

出　　处：《哈尔滨工业大学学报》2014年第11期37-41,共5页Journal of Harbin Institute of Technology

基　　金：国家自然科学基金(51075090);中国博士后科学基金(2011M500655);中国博士后科学基金特别资助(2012T50341)

摘　　要：为实现面阵列电子封装互联钎料凸点的按需式喷射打印,建立一套钎料金属微熔滴按需喷射打印沉积三轴运动平台,并在PC+运动控制卡的基础上,利用Lab VIEW开发了一套微滴喷射打印平台多轴运动控制系统.控制系统可根据互联凸点的坐标数据信息,利用蚁群算法对钎料凸点喷射打印过程中平台的运动路径进行优化,能有效地提高喷射打印效率,实现了凸点打印平台的运动控制.用激光干涉仪对平台运动过程中的定位精度及重复定位精度的测量结果表明,平台的运动满足球栅阵列(BGA)封装凸点打印的精度要求.A micro-droplet printing deposition 3-axis motion platform was established to achieve efficient plane array package interconnect solder bumps jet printing. The platform and the multi-axis motion control system were developed based on LabVIEW, with the structure of “PC＋ motion control card”. According to the coordinate data of the solder bumps, the jet printing movement path optimization was realized with ant colony algorithm, and the efficiency of movement was also improved effectively. A laser interferometer was used to measure the repeatability and positioning accuracy of the motion platform, and the results showed that the motion platform could meet the accuracy requirement of the BGA packaging technology.

关 键 词：封装 钎料凸点 按需喷射 多轴运动控制 路径规划 蚁群算法 

分 类 号：TH16[机械工程—机械制造及自动化]