用于三维封装的多层芯片键合对准技术  

Multichip alignment technology for 3D stack bonding and packaging

作　　者：陈明祥[1,2] 吕亚平[1] 刘孝刚[1] 刘胜[1,2] 

机构地区：[1]华中科技大学机械科学与工程学院,湖北武汉430074 [2]武汉光电国家实验室微光机电系统研究部,湖北武汉430074

出　　处：《华中科技大学学报（自然科学版）》2015年第2期1-5,共5页Journal of Huazhong University of Science and Technology(Natural Science Edition)

基　　金：国家自然科学基金资助项目(51275194);国家重大科技专项基金资助项目(2009ZX02038)

摘　　要：采用离心力使硅片直角边与模具凹槽直角边贴紧对准的思想,提出了一种用于三维系统封装的多芯片对准技术.基于该技术原理制作了对准装置,并实现了多芯片一次性对准键合(6层芯片).具体过程包括:加工带方形凹槽的模具;将芯片切割为形状一致的方形,并保证边缘整齐;将芯片置入凹槽并旋转模具,对准后停止旋转并夹紧固定堆叠芯片;将固定后的芯片转移至键合腔内实现键合,试验测试键合后对准误差为4μm.具体分析了影响多层芯片对准精度的因素,并提出了优化方案,论证了离心对准技术的可行性.A centrifugalization alignment technology for multichip bonding in 3Dpackaging was proposed.The alignment device was made on the basis of this principle which realize multiple alignment bonging at the same time（6chips）.The specific process includes cutting chips into the same square with neatly edges;fabricating a mould with 4rectangular grooves;putting the chips into the grooves and rotating the mould until all the chips alignment;fixing the chips stack and transfer them to the bonding chamber in the bonder.The alignment principles were discussed in detail and the measured alignment accuracy was about 4μm.The factors that affect the accuracy of this method and the device were analyzed and some realizable optimization schemes were put forward to solve these problems,which demonstrated the feasibility of centrifugalization alignment technology.

关 键 词：键合 多芯片键合 对准精度 离心对准 三维封装 

分 类 号：TN04[电子电信—物理电子学]