全自动高温湿法刻蚀设备的研制  

Development of Automatic-High Temperature Wet Etching Equipment

作　　者：祝福生[1] 段成龙[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京101601

出　　处：《电子工业专用设备》2015年第12期8-12,共5页Equipment for Electronic Products Manufacturing

摘　　要：介绍了高温湿法刻蚀设备在LED芯片制造中图形化衬底制备工艺(PSS)及激光正切后侧边腐蚀工艺两方面的应用;论述了高温强酸刻蚀湿法设备组成、结构及单元模块的功能。The application of high temperature wet etching equipment in preparation process of Patterned Sapphire Substrates and Sapphire Sidewall Etching process after laser tangent during LED chip manufacturing is introduced.The component,structure and unit module function of high temperature acid etching wet equipment is discussed in detail in this paper.

关 键 词：图形化衬底 侧边腐蚀 干法刻蚀 湿法刻蚀 

分 类 号：TN305.7[电子电信—物理电子学]