陶瓷封装外引线弯曲疲劳强度的几何结晶学研究  

Effect of Geometry and Crystallography on Bend Fatigue Strength of Ceramic Package Leads

作　　者：陈宇宁[1] 唐利锋[1] 陈寰贝[1] 庞学满[1] 李华新[1] 程凯[1] CHEN Yuning;TANG Lifeng;CHEN Huanbei;PANG Xueman;LI Huaxin;CHENG Kai(Nanjing Electronic Devices Institute,Nanjing,210016,CHN)

机构地区：[1]南京电子器件研究所,南京210016

出　　处：《固体电子学研究与进展》2018年第5期378-381,387,共5页Research & Progress of SSE

摘　　要：采用铁镍合金材料制备了小截面积引线陶瓷封装外壳,通过分析陶瓷外引线弯曲疲劳强度的几何结晶学状态,得到弯曲疲劳次数随着引线截面积增大而增加。弯曲角度是影响引线弯曲疲劳强度的重要因素之一,当弯曲角度从0°～90°增加到-45°～+85°,疲劳强度约降低一半。结晶温度显著影响引线内部晶粒形成与长大的状态,随结晶温度升高,引线弯曲疲劳强度呈现先增加后降低的变化趋势。A kind of ceramic package with small cross sectional area leads by employing Fe-Ni alloy was presented. The effects of geometry and crystallography on the bend fatigue strength of ceramic package leads were studied. It is found that the lead fatigue strength is increased with the increase of cross sectional area. Bend angle is one of the important factors that influences lead fatigue strength. When the bend angle increases from 0°～ 90° to -45°～ ＋ 85°, lead fatigue strength decreases by a factor of two. The crystal formation and growth of leads are influenced by crystallization temperature remarkably.

关 键 词：引线 陶瓷外壳 弯曲疲劳 结晶学 

分 类 号：TN305[电子电信—物理电子学] TN454