微电子工艺中的清洗技术进展  

Cleaning Technology in Microelectronics Process

作　　者：何寒冰 罗小琴 HE Hanbing;LUO Xiaoqin(Chongqing Jiumi Electronic Technology Co.,Ltd,Chongqing 404100,China;Sichuan Railway Vocational College,Sichuan 610097,China)

机构地区：[1]重庆玖米电子科技有限公司,重庆404100 [2]四川铁道职业学院,四川610097

出　　处：《集成电路应用》2020年第6期108-109,共2页Application of IC

基　　金：重庆市中小企业科技创新课题项目。

摘　　要：分析表明,微电子产品在制造过程中由于污染物的影响,降低了合格率,需要进行有效的清洗。阐述微电子工艺中的湿法清洗、干法清洗技术,现状与技术发展的展望。The analysis shows that the qualified rate of microelectronic products is reduced due to the influence of pollutants in the manufacturing process,and effective cleaning is needed.In this paper,the technology of wet cleaning and dry cleaning in microelectronics technology,the present situation and the prospect of technology development are described.

关 键 词：微电子工艺 湿法清洗 干法清洗 

分 类 号：TN405[电子电信—微电子学与固体电子学]