基于弹性连接器的板级垂直互连技术  

Board-level Vertical Interconnection Based on Elastic Connector

作　　者：王辉[1] 徐榕青 董乐[1] 李阳阳[1] 庞婷[1] WANG Hui;XU Rongqing;DONG Le;LI Yangyang;PANG Ting(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,成都610036

出　　处：《电子与封装》2020年第12期22-25,共4页Electronics & Packaging

摘　　要：垂直互连技术具有互连路径短、平面空间占用少等优点,是实现电子系统微型化的一种重要互连方式。设计了一种由导电硅橡胶和金属底盘组成的弹性连接器结构,它通过弹性压接方式直接实现基板与封装电路之间的信号传输。通过相应的试验测试,该弹性连接器在0~18 GHz频段内插损优于2 d B,在18~40 GHz频段内插损优于5 d B,且在0~40 GHz频段内驻波小于2,基本满足射频互连的使用要求。Vertical interconnection technology has the advantages of short interconnection paths and less plane space occupation.It is an important interconnection method for miniaturizing electronic systems.In this paper,we designed an elastic connector structure composed of conductive silicon rubber and metal chassis,the signal transmission between the board and the package circuit is achieved.Through experimental tests,the insertion loss of the elastic connector is better than 2 d B in 0-18 GHz band,better than 5 d B in 18-40 GHz band and the standing wave is less than 2 in 0-40 GHz.The elastic connector basically meets the requirements of RF interconnection.

关 键 词：弹性连接器 垂直互连 3D封装 射频互连 

分 类 号：TN305.94[电子电信—物理电子学]